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Packaging Design Engineer - IoT BigData Jobs

Packaging Design Engineer

Packaging Design Engineer

Phoenix, AZ 85018 (Camelback East area) 2016-11-11 - –

intel Intel

Job Description

At Assembly and Test Technology Development (ATTD) Division, we deliver cutting-edge microelectronics packaging technology solutions for all of our Intel products – ranging from complex servers that propel data farms and cloud computing, to coolest and awe-inspiring IoT devices.

ATTD is an organization, that operates at the forefront of packaging technology – researching and developing products years before their market release. We are staffed with multifaceted and passionate engineers and technical professionals. Our organization teems with opportunities for career growth and development making it a perfect place to build a long, strong, and a fulfilling career at Intel Corporation.

Packaging Design Engineer (PDE) working in ATTD's Design group is responsible for delivering effective Test Vehicle package designs that are used to assess and certify aspects of manufacturing, assembly, and reliability of Intel's microelectronics packages.

We promise our PDEs enjoyable engineering tasks coupled with all the fun of project management!

PDEs will be responsible for:

Understanding packaging technology development FMEAs, product packaging requirements (physical and electrical).

Leading the test vehicle working group and work with key internal partners to comprehend the detailed design requirements for test vehicles.

Develop robust and optimal design solutions through CAD layout using package design tools and meet stakeholder requirements.

Lucid documentation of design inputs, and quality outputs (CAD layout, pin map, validation reports etc.) that aid manufacturing, assembly, and testing methods.

Validation of the design for flawless functionality, quality, and reliability.

Directing design tradeoffs and driving decision making in a dynamic, cross-functional, team oriented environment.

Ability to learn and adapt to multiple CAD tools and other design software applications.


Minimum Qualifications

  • Bachelors or Masters in Mechanical, Electrical, or Chemical Engineering

    Highly preferred skill sets:

    CAD experience (beginner to advanced) – Mentor Expedition, Cadence, Solidworks, AutoCAD etc.

    Microsoft Office Suite (intermediate to advanced).

    Scripting skills (beginner to advanced).

    Inside this Business Group

    As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

    Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

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